Tin Dipping Testing Tin adhesion test, tin adhesion test, tin adhesion ability test, Solderability test, test the solderability of SMT electronic components, electronic components, PCB PAD.
Tin Dipping Test Purpose Solderability is commonly used to evaluate the solderability and wettability of electronic components. It is also a reference for evaluating the reliability of PCB welding process.
Tin dipping test is mainly used to evaluate the wettability of various components, SMT surface mount devices, PCB pads, joint flux, metal flux and solder paste.
How to do the tin test? There are generally two types of tin dipping test methods: tin ball method and tin bath method.
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